Achieves high-speed and stable solder ball mounting with a unique solder ball mounting method!
This is a micro ball mounter compatible with 8-inch and 12-inch wafers.
It has evolved from the best-selling BM-1120W in the global market to the BM-1300W, and further advanced to the successor model BM-1310W, which achieves even faster and more stable ball mounting.
【Features】
■ High-speed and stable ball mounting enabled by a unique ball mounting method
■ Simplified maintenance due to a simple mechanism
■ Compatible with silicon wafers and molded wafers
■ Optimized ball insertion method for efficient and waste-free ball usage
■ Compatible with SECS/GEM and AGV (optional)
*For more details, please refer to the PDF document or feel free to contact us.
- Company:日精 本社
- Price:Other